Cavity down plastic ball grid array multi-chip module
US6127726A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1999 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | May 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit assembly comprising a substrate, a first set of contacts, a second set of contacts, and a third set of contacts. Also, a plurality of electrically conductive lines located on the substrate providing electrical connection between the first set of contacts, the second set of contacts, and the third set of contacts, wherein the plurality of electrically conductive lines are configured such that data can be transferred between the first set of contacts, the second set of contacts and the third set of contacts. A first die is electrically connected to the first set of contacts, and a molding compound surrounds the substrate, wherein the molding compound is formed such that the second set of contacts is exposed allowing electrical connection of the second die to the second set of contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.