Inventor · Lake Forest Park, WA, US

Donald C. Foster

113Patents
26h-index
107Co-inventors
93Inventor score

Filing activity: Aug 15, 1985 → Jul 12, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US6818973B1 Exposed lead QFP package fabricated through the use of a partial saw process Electricity 124 Expired
US6603072B1 Making leadframe semiconductor packages with stacked dies and interconnecting interposer Electricity 99 Expired
US7629674B1 Shielded package having shield fence Electricity 98 Active
US6995459B2 Semiconductor package with increased number of input and output pins Electricity 94 Expired
US7245007B1 Exposed lead interposer leadframe package Electricity 93 Expired
US6307024A Cytokine zalpha11 Ligand Physics 89 Expired
US7211471B1 Exposed lead QFP package fabricated through the use of a partial saw process Electricity 86 Expired
US6876068B1 Semiconductor package with increased number of input and output pins Electricity 78 Expired
US6605272B2 Methods of using zalpha11 ligand Physics 64 Expired
US5225537A Methods for producing hybrid phospholipid-binding proteins Chemistry; Metallurgy 62 Expired
US6627977B1 Semiconductor package including isolated ring structure Electricity 58 Expired
US5925735A Hematopoietic cytokine receptor Chemistry; Metallurgy 55 Expired
US6686178B2 Cytokine zalpha11 ligand polynucleotides Physics 52 Expired
US6437449B1 Making semiconductor devices having stacked dies with biased back surfaces Electricity 50 Expired
US4959318A Expression of protein C Emerging Cross-Sectional Technologies 49 Expired
US5516650A Production of activated protein C Chemistry; Metallurgy 48 Expired
US5441931A Human amyloid protein precursor homologue and Kunitz-type inhibitors Human Necessities 43 Expired
US5677146A Human amyloid protein precursor homolog and kunitz-type inhibitor Human Necessities 43 Expired
US6429513B1 Active heat sink for cooling a semiconductor chip Electricity 42 Expired
US6552416B1 Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring Electricity 40 Expired
US6127726A Cavity down plastic ball grid array multi-chip module Electricity 35 Expired
US8551820B1 Routable single layer substrate and semiconductor package including same Electricity 33 Active
US6087473A Kunitz domain polypeptide and materials and methods for making it Human Necessities 32 Expired
US5770445A Glucagon receptor proteins, peptides, and antibodies Physics 31 Expired
US5639940A Production of fibrinogen in transgenic animals Chemistry; Metallurgy 30 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.