High speed lead inspection system
US6128034A · kind A · utility
7Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1994 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | Feb 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0818
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An inspection system determines if leads of a semiconductor device are in proper positions. Images from at least two sides of the semiconductor device are captured along with calibration marks formed in the side of a track upon which the semiconductor device is mounted. All leads and calibration marks are captured in a single video image, the images from one side of the semiconductor device being off set from the image from the other side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.