Transfer molded PCMCIA standard cards
US6128195A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1997 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | Nov 18, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/946
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.