Method for drying substrates

US6128829A · kind A · utility

Assignee

• Steag Micro Tech GmbH · DE

Inventors

• Klaus Conrad Wolke · Althengstett, DE
• Martin Weber · Borgo San Lazzaro, DE

Key dates

• Filing date: Mar 10, 1999
• Grant date: Oct 10, 2000
• Expiry date: Mar 10, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S134/902
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In a method for drying substrates, in particular, semiconductor wafers, an especially residue-free drying of the substrates results when, during removal of the substrates from a liquid, a meniscus of the liquid forming at the transition between the substrate surface and the liquid surface is heated. A device for performing the method is disclosed.