Multi-chip assembly having a heat sink and method thereof
US6130821A · kind A · utility
26Cited by
8References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 3, 1998 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Dec 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip assembly (100) uses a clip (110) to retain multiple integrated circuits (124-130) to an assembly substrate (140). The use of a thermal medium between the integrated circuits and the heat sinks (120, 122) allows the assembly to be disassembled for rework purposes. The clip contains edge clamps (112), alignment rails (114), and alignment features (116, 316, 416) to properly orient the clip, heat sink, integrated circuits, and assembly substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.