Mark A. Gerber
43Patents
12h-index
30Co-inventors
81Inventor score
Filing activity: Dec 7, 1995 → May 24, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6476506B1 | Packaged semiconductor with multiple rows of bond pads and method therefor | Electricity | 129 | Expired |
| US7675152B2 | Package-on-package semiconductor assembly | Electricity | 112 | Expired |
| US7790509B2 | Method for fine-pitch, low stress flip-chip interconnect | Electricity | 58 | Active |
| US7390700B2 | Packaged system of semiconductor chips having a semiconductor interposer | Electricity | 55 | Active |
| US7944034B2 | Array molded package-on-package having redistribution lines | Emerging Cross-Sectional Technologies | 46 | Active |
| US7582963B2 | Vertically integrated system-in-a-package | Electricity | 43 | Expired |
| US5759049A | Electrical contact clip | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6130821A | Multi-chip assembly having a heat sink and method thereof | Electricity | 26 | Expired |
| USD384336S | Power cap cover | General | 25 | Expired |
| US7394900B1 | Method and apparatus for preventing the interception of data being transmitted to a web site by a monitoring program | Physics | 23 | Expired |
| US8133761B2 | Packaged system of semiconductor chips having a semiconductor interposer | Electricity | 17 | Active |
| USD383438S | Power module cover | General | 16 | Expired |
| US6916682B2 | Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testing | Electricity | 12 | Expired |
| US7569918B2 | Semiconductor package-on-package system including integrated passive components | Electricity | 10 | Active |
| US7573139B2 | Packed system of semiconductor chips having a semiconductor interposer | Electricity | 10 | Active |
| US7547630B2 | Method for stacking semiconductor chips | Electricity | 9 | Active |
| US6879028B2 | Multi-die semiconductor package | Electricity | 9 | Expired |
| US6020634A | Replaceable power module | Emerging Cross-Sectional Technologies | 8 | Expired |
| US10177099B2 | Semiconductor package structure, package on package structure and packaging method | Electricity | 4 | Active |
| US6858932B2 | Packaged semiconductor device and method of formation | Electricity | 3 | Expired |
| US8574967B2 | Method for fabricating array-molded package-on-package | Electricity | 3 | Active |
| US8304285B2 | Array-molded package-on-package having redistribution lines | Emerging Cross-Sectional Technologies | 3 | Active |
| US6847102B2 | Low profile semiconductor device having improved heat dissipation | Electricity | 3 | Expired |
| US7776653B2 | Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices | Electricity | 2 | Active |
| US7573137B2 | Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.