Balancing of x and y axis bonding by 45 degree capillary positioning
US6131792A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2000 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | Mar 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while travelling in a first predetermined direction, the first bonding head having a first major axis and a first minor axis normal to the first major axis, the first major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the first predetermined direction and a second bonding head designed to form a stitch bond while travelling in a second predetermined direction, the second bonding head having a second major axis and a second minor axis normal to the second major axis, the second major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the second predetermined direction. An area having bonding locations to which the bonder is to make wire bonds is divided into a plurality of regions. Then the first bonding head is caused to make wire bonds in a predetermined one of the plurality of regions and the second bonding head is caused to make wire bonds in a predetermined second one of the plurality of regions.…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.