Willmar Subido
22Patents
8h-index
27Co-inventors
75Inventor score
Filing activity: Oct 26, 1998 → Sep 21, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6800555B2 | Wire bonding process for copper-metallized integrated circuits | Electricity | 132 | Expired |
| US6268662A | Wire bonded flip-chip assembly of semiconductor devices | Electricity | 113 | Expired |
| US6329722A | Bonding pads for integrated circuits having copper interconnect metallization | Electricity | 50 | Expired |
| US9812402B2 | Wire bond wires for interference shielding | Electricity | 25 | Active |
| US10115678B2 | Wire bond wires for interference shielding | Electricity | 21 | Active |
| US9490222B1 | Wire bond wires for interference shielding | Electricity | 16 | Active |
| US6521479B1 | Repackaging semiconductor IC devices for failure analysis | Electricity | 11 | Expired |
| US10490528B2 | Embedded wire bond wires | Electricity | 11 | Active |
| US10559537B2 | Wire bond wires for interference shielding | Electricity | 8 | Active |
| US6182882A | Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe | Electricity | 7 | Expired |
| US6855578B2 | Vibration-assisted method for underfilling flip-chip electronic devices | Electricity | 6 | Expired |
| US6112973A | Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe | Electricity | 4 | Expired |
| US11462483B2 | Wire bond wires for interference shielding | Electricity | 2 | Active |
| US7476597B2 | Methods and systems for laser assisted wirebonding | Electricity | 1 | Active |
| US10008469B2 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Electricity | 1 | Active |
| US6131792A | Balancing of x and y axis bonding by 45 degree capillary positioning | Electricity | 1 | Expired |
| US11810867B2 | Wire bond wires for interference shielding | Electricity | 1 | Active |
| US9530749B2 | Coupling of side surface contacts to a circuit platform | Electricity | 0 | Active |
| US9502372B1 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Electricity | 0 | Active |
| US12255153B2 | Wire bond wires for interference shielding | Electricity | 0 | Active |
| US6089443A | Balancing of x and y axis bonding by 45 degree capillary positioning | Electricity | 0 | Expired |
| US9761554B2 | Ball bonding metal wire bond wires to metal pads | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.