Methods for exhausting a wafer coating apparatus
US6132802A · kind A · utility
6Cited by
23References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1998 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | Jun 22, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.