Patent · US Expired

ArF photoresist copolymers

US6132926A · kind A · utility

46Cited by
10References
40Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 30, 1997
Grant dateOct 17, 2000
Priority date
Expiry dateDec 30, 2017

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/039
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A photoresist including a copolymer prepared from bicycloalkene derivative, maleic anhydride and/or vinylene carbonate, which has molecular weight ranging from about 3,000 to 100,000. The photoresist can be used for submicrolithography employing deep ultra violety as a light source. In addition to being of high etch resistance and thermal resistance, the photoresist has good adhesiveness and can be developed in a TMAH solution.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.