Flip chip ball grid array package with laminated substrate
US6133064A · kind A · utility
54Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 1999 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | May 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus pertaining to flip chip ball grid array packages are disclosed. A substrate comprises a base layer with a dielectric laminated thereon such that a cavity in the dielectric exposes the base layer. A die is then mounted to the exposed portion of the base layer. Preferably, an upper portion of the dielectric forms a frame for receiving a heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.