Ball grid array integrated circuit package
US6133134A · kind A · utility
15Cited by
4References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 2, 1997 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | Dec 2, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ball grid array integrated circuit package which has a plurality of elliptical shaped solder pads located on a substrate of the package. Routing traces are connected to the apexes of the elliptical shaped solder pads. Connecting a routing trace to the apex of an elliptical shaped solder pad reduces the stress points on the trace/pad interface. Vias may be coupled to the solder pads and the routing traces. The vias are located at the apexes of the elliptical shaped solder pads to reduce the stress points of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.