Wiring board for electrical tests with bumps having polymeric coating
US6133534A · kind A · utility
41Cited by
30References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1994 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | Apr 27, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/931
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board for electrical tests; having an insulating substrate, wiring of predetermined pattern which is embedded in the insulating substrate, and bump electrodes which are formed on the wiring and which are respectively brought into contact with corresponding electrodes of an article to-be-tested. Thus, even when the electrode pitch of the article to-be-tested such as a semiconductor device has become smaller(for example, less than 0.1 [mm]), the electrodes can be formed so as to cope with the electrical tests of the article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.