Inventor · Chikusei, JP

Itsuo Watanabe

38Patents
13h-index
51Co-inventors
80Inventor score

Filing activity: Aug 5, 1992 → Jun 22, 2011

Most-cited inventions

PatentTitleAreaCited byStatus
US6281450A Substrate for mounting semiconductor chips Electricity 143 Expired
US6223429A Method of production of semiconductor device Emerging Cross-Sectional Technologies 82 Expired
US6777464B1 Circuit connecting material, and structure and method of connecting circuit terminal Emerging Cross-Sectional Technologies 48 Expired
US6133534A Wiring board for electrical tests with bumps having polymeric coating Emerging Cross-Sectional Technologies 41 Expired
US6034331A Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet Emerging Cross-Sectional Technologies 36 Expired
US6184577A Electronic component parts device Electricity 35 Expired
US6328844A Filmy adhesive for connecting circuits and circuit board Emerging Cross-Sectional Technologies 24 Expired
US6762249B1 Wiring-connecting material and process for producing circuit board with the same Emerging Cross-Sectional Technologies 18 Expired
US7141645B2 Wiring-connecting material and wiring-connected board production process using the same Emerging Cross-Sectional Technologies 17 Expired
US6568073B1 Process for the fabrication of wiring board for electrical tests Emerging Cross-Sectional Technologies 17 Expired
US6338195B1 Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet Emerging Cross-Sectional Technologies 17 Expired
US6939913B1 Adhesive agent, method of connecting wiring terminals and wiring structure Emerging Cross-Sectional Technologies 14 Expired
US7241644B2 Adhesive, method of connecting wiring terminals and wiring structure Emerging Cross-Sectional Technologies 13 Expired
US8043709B2 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same Emerging Cross-Sectional Technologies 12 Active
US7247381B1 Adhesive for bonding circuit members, circuit board, and method of producing the same Emerging Cross-Sectional Technologies 10 Expired
US7604868B2 Electronic circuit including circuit-connecting material Emerging Cross-Sectional Technologies 7 Expired
US7785708B2 Adhesive film for circuit connection, and circuit connection structure Emerging Cross-Sectional Technologies 7 Expired
US7629056B2 Circuit-connecting material and circuit terminal connected structure and connecting method Emerging Cross-Sectional Technologies 5 Expired
US7777335B2 Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles Emerging Cross-Sectional Technologies 5 Expired
US5464673A Information recording medium having recording layer with organic polymer and dye contained therein Emerging Cross-Sectional Technologies 5 Expired
US8115322B2 Adhesive, method of connecting wiring terminals and wiring structure Emerging Cross-Sectional Technologies 4 Active
US7879445B2 Adhesive for bonding circuit members, circuit board and process for its production Emerging Cross-Sectional Technologies 4 Active
US7618713B2 Circuit-connecting material and circuit terminal connected structure and connecting method Emerging Cross-Sectional Technologies 4 Expired
US5648135A Information recording medium having recording layer with organic polymer and dye contained therein Emerging Cross-Sectional Technologies 4 Expired
US7776438B2 Adhesive film for circuit connection, and circuit connection structure Emerging Cross-Sectional Technologies 4 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.