Process for manufacturing a circuit board with filled holes
US6138350A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1998 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Feb 25, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249996
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing circuit boards comprising providing a circuitized substrate having a dielectric surface, providing a peel apart structure including a metal layer and a peelable film, laminating the peel apart structure to the circuitized substrate with the metal layer positioned adjacent said dielectric surface, forming holes in the circuitized substrate through the peel apart structure, applying a filler material including an organic base to the peel apart structure, applying a sacrificial film onto the filler material, and applying sufficient heat and pressure to the sacrificial film to force the filler material into the holes to substantially fill the holes is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.