Method for producing a reliable BGA solder joint interconnection
US6138893A · kind A · utility
13Cited by
22References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1998 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Jun 25, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and an arrangement for measuring the cooling rate and thermal gradient between the top and bottom surfaces of a printed circuit board. Moreover, it is intended to facilitate control over the temperature gradient which is encountered between the top and bottom of the PCB so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.