David V. Caletka
30Patents
15h-index
27Co-inventors
77Inventor score
Filing activity: Aug 2, 1996 → May 24, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6913948B2 | Partially captured oriented interconnections for BGA packages and a method of forming the interconnections | Electricity | 91 | Expired |
| US6507116B1 | Electronic package and method of forming | Electricity | 73 | Expired |
| US6274474A | Method of forming BGA interconnections having mixed solder profiles | Emerging Cross-Sectional Technologies | 63 | Expired |
| US6104093A | Thermally enhanced and mechanically balanced flip chip package and method of forming | Electricity | 61 | Expired |
| US6528892B2 | Land grid array stiffener use with flexible chip carriers | Electricity | 60 | Expired |
| US6774474B1 | Partially captured oriented interconnections for BGA packages and a method of forming the interconnections | Electricity | 51 | Expired |
| US7086147B2 | Method of accommodating in volume expansion during solder reflow | Emerging Cross-Sectional Technologies | 36 | Expired |
| US5947750A | Elastomeric structure with multi-layered elastomer and constraining base | Electricity | 32 | Expired |
| US6695623B2 | Enhanced electrical/mechanical connection for electronic devices | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6627998B1 | Wafer scale thin film package | Emerging Cross-Sectional Technologies | 28 | Expired |
| US6051982A | Electronic component test apparatus with rotational probe and conductive spaced apart means | Physics | 27 | Expired |
| US6410988B1 | Thermally enhanced and mechanically balanced flip chip package and method of forming | Electricity | 22 | Expired |
| US6541857B2 | Method of forming BGA interconnections having mixed solder profiles | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6933619B2 | Electronic package and method of forming | Electricity | 18 | Expired |
| US5873740A | Electrical connector system with member having layers of different durometer elastomeric materials | Electricity | 17 | Expired |
| US6333551A | Surface profiling in electronic packages for reducing thermally induced interfacial stresses | Electricity | 14 | Expired |
| US6138893A | Method for producing a reliable BGA solder joint interconnection | Electricity | 13 | Expired |
| US5804984A | Electronic component test apparatus with rotational probe | Physics | 12 | Expired |
| US6268567A | Dual purpose ribbon cable | Electricity | 8 | Expired |
| US6603195B1 | Planarized plastic package modules for integrated circuits | Electricity | 8 | Expired |
| US6433283B1 | Dual purpose ribbon cable | Electricity | 7 | Expired |
| US6649833B1 | Negative volume expansion lead-free electrical connection | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6686664B2 | Structure to accommodate increase in volume expansion during solder reflow | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6672500B2 | Method for producing a reliable solder joint interconnection | Electricity | 3 | Expired |
| US6293455A | Method for producing a reliable BGA solder joint interconnection | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.