Method and apparatus for forming a layer on a substrate
US6139696A · kind A · utility
10Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1999 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Oct 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02266
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and an apparatus for forming a layer on a substrate are disclosed. In accordance with one embodiment, a substrate (901) is placed into a chamber (30) that includes a coil (16) and a shield (14) wherein the coil and the shield are electrically isolated by an isolation/support member (32) having a first surface (321) that is substantially contiguous with a surface of the coil and having a second surface (322) that is substantially contiguous with a surface of the shield. A layer (1002, 1102) is then deposited onto the substrate (901).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.