Adhesive tape, base material for adhesive tape and their manufacturing methods
US6139953A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1997 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Mar 13, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31576
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A base material has a radiation-cured material prepared by curing a mixture of urethane acrylate oligomer and reactive dilute monomer, and also it shows a breaking elongation of more than 10%, preferably of more than 100%. The base material is used as a base sheet of an adhesive tape where an adhesive layer is formed on the base sheet. Accordingly, the novel base material and its manufacturing method in addition to an adhesive tape having such base material are provided. Furthermore, the adhesive tape has a flat surface without any fish-eye that causes the troubles of cracking, chip-scattering, and so on in the steps of back-grinding and dicing of the semiconductor wafer, and also the adhesive tape can be processed so as to have a predetermined thickness with high accuracy, compared with that of the conventional one.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.