Patent · US Expired

Micromechanical sensor

US6140689A · kind A · utility

54Cited by

6References

6Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Thomas Scheiter · Munich, DE
Ulrich Naher · Hersbruck, DE
Christofer Hierold · Munich, DE

Key dates

Filing date	Dec 21, 1998
Grant date	Oct 31, 2000
Priority date	—
Expiry date	Dec 21, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH04R19/005
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

In a relative pressure sensor or miniaturized microphone as a micromechanical sensor component, a polysilicon membrane is arranged over a polysilicon membrane of an SOI substrate. A recess that is connected to the cavity between the membrane and the body silicon layer by openings in the body silicon layer is present in the substrate on the back side. Given an excursion of the membrane, a pressure equalization can therefore occur in the cavity as a result of these openings. The measurement occurs capacitatively by electrical connection of the electrically conductively doped membrane and a doped region formed in the body silicon layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.