Alignment correction prior to image sampling in inspection systems
US6141038A · kind A · utility
53Cited by
11References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 1997 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Jun 27, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, those electronic images are compared to detect any defects that may exist on one of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.