Multi-chip semiconductor device and method of producing the same
US6143590A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1999 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Jan 11, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor device including: a ceramic base board formed of AlN; a CPU chip and a CMU chip which are flip-chip bonded on a circuit board which includes the ceramic base board; SRAM chips which are die-bonded to the lower major surface of the circuit board; first heat conductive blocks adhesively attached to the CPU chip and the CMU chip; second heat conductive blocks adhesively attached to the upper major surface of the AlN ceramic base board; a resin package; and a heat sink which, adhesively attached on the upper major surface of the resin package, is in close contact with the first heat conductive blocks and the second heat conductive blocks. The heat generated by the CPU chip and the CMU chip is transferred to the heat sink via the first heat conductive blocks and is radiated from the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.