Laser diode and substrate
US6146025A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1998 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Aug 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02415
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An improved laser diode is taught. A laser diode chip with an optical port for outputing an optical signal is mounted on a substrate. The substrate has a perimeter that extends beyond the area of the laser diode chip. The lens face of an optical fiber is aligned to receive the optical signal from the optical port. The optical fiber is secured at a pad location on the substrate with a solder ball. A portion of the substrate is mounted on a TEC leaving an overhang portion unsupported by the TEC. The overhang portion of the substrate forms a ledge portion of the substrate. A thermal insulating slot and a stress relief slot are micromachined through the substrate forming an "L" shaped slot defining a cantilever fiber support segment of the substrate. The fiber is mounted on the end of the fiber support segment with a solder ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.