Apparatus and method for cleaning semiconductor wafers
US6146469A · kind A · utility
36Cited by
10References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 25, 1998 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Feb 25, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an apparatus and method for cleaning post-etch semiconductor wafers using ultra-pure dry steam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.