Inverted field circular magnetron sputtering device
US6146509A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 11, 1999 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Jun 11, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An inverted field circular planar magnetron sputtering device is described that produces coatings with a high degree of thickness uniformity on round wafer-like substrates. It is a compact source with no moving mechanical parts. DC signals applied to low power electromagnetic coils provide control of the coating thickness uniformity throughout the life of the target. AC signals applied to the coils oscillate the sputtering rings to improve target utilization and maintain a clean target surface. Utilization of target material is about 40% for both magnetic and non-magnetic target materials. The design accommodates versions for both direct and indirect water cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.