Solvent prewet and method to dispense the solvent prewet
US6147010A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 19, 1997 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Nov 19, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/16
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus is provided for more efficiently application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating to accommodate the application of solvent tot he center of the wafer surface. The method also describes incorporating a new solvent comprising DI-Acetone Alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.