Image sensor package with image plane reference
US6147389A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1999 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Jul 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package that provides a reference plane relative to an image plane of an image sensor is described. The reference plane is aligned with respect to the image plane of the sensor such that the sensor can be mounted in an optical assembly quickly, easily, accurately, and inexpensively. The package can be thin, allowing for use of the package in retrofit applications such as using the packaged image sensor in a conventional 35 mm camera. The package includes a standoff frame for mounting a transparent window. The package includes reference members, such as rails, that define the reference plane. The package provides a desired tolerance between the reference plane and image plane of the sensor when the sensor is bonded into the package. The window can be flat or configured as a lens to focus the image on the image plane. The window can be configured such that its front (outer) face becomes the image plane of the packaged image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.