William B. Hornback
6Patents
5h-index
7Co-inventors
56Inventor score
Filing activity: Apr 8, 1991 → Feb 12, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6147389A | Image sensor package with image plane reference | Electricity | 67 | Expired |
| US5135556A | Method for making fused high density multi-layer integrated circuit module | Electricity | 36 | Expired |
| US5128749A | Fused high density multi-layer integrated circuit module | Electricity | 12 | Expired |
| US6476392B1 | Method and apparatus for temperature compensation of an uncooled focal plane array | Electricity | 10 | Expired |
| US6891160B2 | Method and apparatus for temperature compensation of an uncooled focal plane array | Electricity | 7 | Expired |
| US9426389B1 | Second imaging device adaptable for use with first imaging device and method for using same | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.