Differential pressure sensor and method thereof
US6148673A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 7, 1994 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Oct 7, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A differential pressure sensor (10) has a sensor die (30) eutectically attached to a mounting flag (14). The mounting flag has a similar coefficient of thermal expansion to the sensor die. The eutectic attachment provides a hermetic seal between the mounting flag and the sensor die. Pressure is applied to sensor die port (20). A molded housing (12) is molded around the sensor die-mounting flag assembly. Port (22) in the molded housing is filled with a silicone gel (52). A second pressure source is transferred by way of the silicone gel to the sensor die. Any media entering port (20) contacts the first surface of the sensor die to assert pressure against a piezoresistive transducer circuit (32) to generate the electrical signals representative of the applied pressure but are isolated from the sensitive interconnects by the hermetic seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.