Linear pad conditioning apparatus
US6149512A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1997 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Nov 6, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/775
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A linear pad conditioning mechanism provides a linear in situ or ex situ conditioning for a polishing pad mounted on a polishing belt of a CMP apparatus. The linear pad conditioning mechanism includes a linear oscillation mechanism for driving a conditioning pad in a direction orthogonal to the polishing belt's direction of travel. In one example, multiple conditioning assemblies are provided to each provide a trapezoidal conditioning pad, and the conditioning assemblies are positioned such that a constant-width area in the polishing belt's direction of travel is provided. In that example, a rotational mechanism is provided to position the conditioning pad between a conditioning position against the polishing pad, and a cleaning position in a bath of cleaning fluid. Further, each conditioning assembly is provided a fluid delivery system to a conditioner block, so that a conditioner fluid can be delivered at the point of use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.