Component carrier with raised bonding sites
US6150726A · kind A · utility
35Cited by
26References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1998 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Jun 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0769
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.