Modulator transfer process and assembly
US6151153A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1998 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Jun 16, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/0305
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A technique for fabricating an electro-optic modulator material 1009 onto a transfer substrate 1001. The technique includes a method, which provides a first transfer substrate 1001. The method includes a step of forming an electro-optic material 1009 onto a surface of the first transfer substrate 1001 to attach the electro-optic material 1009 to the first transfer substrate 1001. A step of applying or forming a second transfer substrate 1008 overlying the electro-optic material 1009 is included. The second transfer substrate 1008 is attached using an adhesive to the electro-optic material at lower strength than the attachment of the first transfer substrate to the electro-optic material. To use the electro-optic material, a step of removing 1017 the second transfer substrate 1008 from the electro-optic modulator material 1009, which leaves the electro-optic material substantially affixed to the first transfer material, is also included. These steps provide for an easy technique for forming an electro-optic material 1009 on a transfer substrate 1001.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.