Method and apparatus for preventing etch rate drop after machine idle in plasma etch chamber
US6153849A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1999 |
| Grant date | Nov 28, 2000 |
| Priority date | — |
| Expiry date | Jan 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32137
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and a method for preventing etch rate drop after a machine idle time in a plasma etch chamber are disclosed. In the apparatus, an enclosure for enclosing a top plate in the plasma etch chamber is provided which is equipped with a heater in fluid communication with the enclosure. The top plate which includes a dielectric window and an inductive coil can be heated to a temperature between about 35.degree. C. and about 45.degree. C. during machine idle time to prevent etch rate drop after the chamber is restarted. The plasma etch chamber may be an inductively coupled RF plasma etcher. The heater may be constructed by a heater housing which is in fluid communication with the enclosure, at least one heating lamp in the housing, and a blower for delivering heated air into the enclosure cavity. By utilizing the present invention novel apparatus and method, etch rate can be substantially maintained even after a machine idle time and an under-etch condition can be prevented to substantially eliminate scrap of defective wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.