Core metal soldering knob flip-chip technology

US6153940A · kind A · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Elke Zakel · Falkensee, DE
• Jens Nave · Berlin, DE
• Joachim Eldring · Phoenix, US

Key dates

• Filing date: Aug 4, 1997
• Grant date: Nov 28, 2000
• Expiry date: Aug 4, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a solder bump of an inhomogeneous material compoion for connecting contact pad metallizations of different electronic components or substrates in flip-chip technology, as well as to a method of making such a solder bump. A solder bump consists of a space defining high-melting solder bump core and a layer of a preferably low-melting solder material deposited thereon. The preconditions required for soldering, such as solder deposition, bump height and soldering temperature are thus all combined in the solder bump.