Structure to effect adhesion between substrate and ink barrier in ink jet printhead

US6155674A · kind A · utility

Assignee

• Hewlett-Packard Company, L.P. · US

Inventors

• Domingo Figueredo · San Jose, US
• Gregory Hindman · Albany, US
• Brian J. Keefe · Village of La Jolla, US
• Ali Emamjomeh · San Diego, US
• Roger J. Kolodziej · Corvallis, US
• Grant Webster · Valley Center, US
• Terri I. Chapman · Escondido, US

Key dates

• Filing date: Mar 4, 1997
• Grant date: Dec 5, 2000
• Expiry date: Mar 4, 2017

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B41J2202/03
• WIPO field: Textile and paper machines
• WIPO sector: Mechanical engineering

Abstract

A thermal ink jet printhead that includes an adhesion interface between a silicon carbide layer of a thin film substrate and a polymer ink barrier layer in the vicinity of ink chambers formed in the polymer ink barrier layer, and an adhesion interface between a silicon carbide layer disposed on the ink barrier layer and an orifice plate. An intervening adhesion promoter can be located between the silicon carbide layer of the thin film substrate and the polymer ink barrier layer, and between the silicon carbide layer disposed on the ink barrier layer and the orifice plate.