IC component separating method and separating apparatus
US6156150A · kind A · utility
23Cited by
8References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 14, 1998 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Oct 14, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for separating an IC component (1) from a board (3). The method includes the processes of positioning a tool (21) just above the IC component, thereafter moving the tool down into a specified position, making the tool cover the IC component that is mounted on the board via an adhesive material, solder, or paste, and separating the IC component from the board by turning the tool. Through these processes, the IC component can be separated with a relatively small force, so that cracking of the IC component and damage to the board can be suppressed to a minimum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.