Method of manufacturing cylindrical shaped capacitor
US6156608A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 14, 1998 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Oct 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/033
Abstract
A method of manufacturing a cylindrical shaped capacitor includes the steps of providing a substrate that already has a polysilicon plug and a word line formed thereon, and then forming an insulation layer and a first dielectric layer over the substrate. Thereafter, the first dielectric layer is patterned to form an opening. Then, a first conductive layer and a second dielectric layer are deposited in sequence over the first dielectric layer and the opening. Next, the first conductive layer and the second dielectric layer are etched back to form spacers on the sidewalls of the opening. Subsequently, etching is carried out down through the opening using the sidewall spacers as a mask until the polysilicon plug is exposed. After that, a second conductive layer is formed over entire substrate, and then the second conductive layer is etched back so that only a portion of the second conductive layer and the first conductive layer remain. The second and the first conductive layers together constitute the lower electrode of the capacitor. Finally, a dielectric thin film and a third conductive layer are formed in sequence over the lower electrode, thereby establishing a cylindrical shaped …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.