Method of patterning a semiconductor device
US6156669A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 23, 1999 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Dec 23, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/942
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for forming semiconductor devices involves nebulizing a liquid suspension of particles to form tiny droplets of particles and liquid which are well separated from one another. The nebulized droplets may correspond roughly to the average particle size which may be, for example, about one to two microns. The particles in droplet form then form a vaporous dispersion which can be dried to remove the liquid. The particles may be biased so as to repel one another to further form a well defined separation between adjacent particles. The particles may then be collected on a substrate so that a random distribution of masking particles are formed. The randomly distributed particles may be used as a mask for defining features in a semiconductor structure. The mask may be utilized, for example, to define emitters in a field emission display or spacers in a liquid crystal display.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.