End effector for pad conditioning
US6159087A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1999 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Feb 2, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/001
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An end effector is provided for conditioning pads used to polish semiconductor wafers. The end effector has a substrate with a matrix (preferably a polymer) disposed thereon. Abrasive particles such as diamond crystals are embedded in the matrix. Preferred particle size and number/spacing is provided for optimal conditioning. The particles are embedded by at least a predetermined amount (e.g., 75%) so as to provide uniform/repeatable conditioning while avoiding dislodged particles. The particles may be embedded such that the tips thereof are coplanar, or such that the profile of diamond tips form a plurality of curved regions. A method for checking end effector quality is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.