Process for selective transfer of a microstructure formed on an initial substrate to a final substrate
US6159323A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1998 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Nov 24, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0097
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Process for transfer of a microstructure (12) from an initial substrate (10) to a final substrate (32). The process includes the following steps in sequence: PA1 bonding between the initial substrate (10) and an intermediate substrate (24), the microstructure facing the intermediate substrate, PA1 formation of at least one layer (30) of bond material on at least one selected region (16) of the initial substrate including the microstructure PA1 bring the said selected region (16) into contact with the final substrate, PA1 treatment of the bond material in an area corresponding to the selected region (16), to increase the bond force, PA1 breaking the selected region (16) of the initial substrate, from the intermediate substrate (24).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.