Process for producing micromechanical sensors

US6159762A · kind A · utility

Inventors

• Thomas Scheiter · Munich, DE
• Christofer Hierold · Munich, DE
• Ulrich Naher · Hersbruck, DE

Key dates

• Filing date: May 27, 1999
• Grant date: Dec 12, 2000
• Expiry date: May 27, 2019

Classification

• Technology area (CPC G): Physics
• CPC primary: G01L9/0042
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Method for manufacturing an absolute pressure sensor as micromechanical component on a silicon substrate, whereby a cavity (4) is etched out in an auxiliary layer (3) under a membrane layer (5) through etching openings (6), the etching openings are closed with a passivation layer (7), whereby a specific etching opening (11) is re-opened in a via hole etching and this opening is re-closed with a metallization or dielectric material (10, 12) in a following process step that ensues at low pressure.