Slurry containing manganese oxide and a fabrication process of a semiconductor device using such a slurry
US6159858A · kind A · utility
4Cited by
11References
25Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 27, 1997 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Jun 27, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A slurry contains MnO.sub.2 or other manganese oxide as a primary component of abrasive particles. Further, a polishing process using such a manganese oxide abrasive and a fabrication process of a semiconductor device using such a polishing process are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.