Surface measurement apparatus for detecting crystal defects of wafer
US6160615A · kind A · utility
18Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1999 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Feb 23, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/94
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sample is supported flat in high precision by a sample chuck, and is easily mounted and dismounted. A wafer lifting mechanism is arranged in a position separated from a rotating system of a rotatable wafer chuck, and a wafer is lifted from a supporting surface by moving the wafer lifting mechanism upward to let pins penetrate through through holes of the wafer chuck under a state that the wafer chuck is stopped at a sample mounting-and-dismounting position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.