Pd etch mask for copper circuitization
US6162365A · kind A · utility
51Cited by
46References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1998 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Mar 4, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for making a printed circuit board is provided. The process employs a noble metal as an etch mask for subtractive circuitization and as a seed layer for secondary finishing. In a preferred embodiment of the invention, a dielectric is covered by a conductive layer of metal such as copper, a patterned photoresist is applied, additional copper is deposited on areas not covered by the photoresist, and a palladium etch mask/seed layer is deposited on the copper. The palladium layer remains sufficiently active for deposition of nickel or gold on the circuitry for purposes such as wire bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.