Spacer plate solder ball placement fixture and methods therefor
US6162661A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 29, 1998 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method placing conductive elements, such as solder balls, over terminals on a microelectronic assembly includes providing a microelectronic element having a first surface and one or more terminals accessible at the first surface, and securing a spacer plate having a top surface, a bottom surface and at least one opening extending therethrough over the first surface of the microelectronic element so that the at least one opening is in substantial alignment with the terminals. After the spacer plate has been secured over the first surface of the microelectronic element, a stencil for placing conductive elements is then secured over the spacer plate. The stencil has a top surface and a bottom surface and a plurality of openings extending therethrough. When the stencil is secured over the spacer plate, the plurality of openings in the stencil are in substantial alignment with the terminals. As a result, the spacer plate maintains the stencil remote from the terminals. The conductive elements, such as solder balls, are then deposited through the plurality of openings in the stencil so that each deposited conductive element is affixed atop one of the terminals of the microelectronic as…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.