High Q inductor realization for use in MMIC circuits
US6162697A · kind A · utility
54Cited by
4References
6Claims
0Family size
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Key dates
| Filing date | Oct 13, 1998 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Oct 13, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and structures are disclosed which realize high Q inductors to provide on-chip noise matching of microwave monolithic integrated circuits, such as low noise amplifiers and output matching networks for power amplifiers. High Q inductors, of typically 6nH, are devised by using the inductance of package leads, bondwires, electronic board trace wires and transmission lines and other components in various configurations. These and other components are serially connected starting from a chip pad, representing a circuit node, to a circuit input on a that electronic board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.