Institute of Microelectronics
94Patents
0Active
94Granted
41Portfolio score
Filing activity: Jan 4, 1996 → Apr 8, 2003
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6846725B2 | Wafer-level package for micro-electro-mechanical systems | Electricity | 142 | Expired |
| US5925934A | Low cost and highly reliable chip-sized package | Electricity | 138 | Expired |
| US6100195A | Passivation of copper interconnect surfaces with a passivating metal layer | Electricity | 86 | Expired |
| US6762049B2 | Miniaturized multi-chamber thermal cycler for independent thermal multiplexing | Performing Operations; Transporting | 85 | Expired |
| US6509186B1 | Miniaturized thermal cycler | Performing Operations; Transporting | 83 | Expired |
| US6566961B2 | Wide-band single-ended to differential converter in CMOS technology | Electricity | 76 | Expired |
| US6274650A | Epoxy resin compositions for liquid encapsulation | Electricity | 72 | Expired |
| US6424044B1 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Electricity | 68 | Expired |
| US6534374B2 | Single damascene method for RF IC passive component integration in copper interconnect process | Electricity | 67 | Expired |
| US6717812B1 | Apparatus and method for fluid-based cooling of heat-generating devices | Electricity | 62 | Expired |
| US6472962B1 | Inductor-capacitor resonant RF switch | Emerging Cross-Sectional Technologies | 58 | Expired |
| US6162697A | High Q inductor realization for use in MMIC circuits | Electricity | 54 | Expired |
| US6743713B2 | Method of forming dual damascene pattern using dual bottom anti-reflective coatings (BARC) | Electricity | 54 | Expired |
| US6461902B1 | RF LDMOS on partial SOI substrate | Emerging Cross-Sectional Technologies | 48 | Expired |
| US6468906B1 | Passivation of copper interconnect surfaces with a passivating metal layer | Electricity | 45 | Expired |
| US5893724A | Method for forming a highly reliable and planar ball grid array package | Electricity | 45 | Expired |
| US6667189B1 | High performance silicon condenser microphone with perforated single crystal silicon backplate | Emerging Cross-Sectional Technologies | 43 | Expired |
| US6892060B2 | Fully integrated self-tuned image rejection downconversion system | Electricity | 42 | Expired |
| US5892290A | Highly reliable and planar ball grid array package | Electricity | 37 | Expired |
| US6461888B1 | Lateral polysilicon beam process | Performing Operations; Transporting | 35 | Expired |
| US6432695B1 | Miniaturized thermal cycler | Performing Operations; Transporting | 34 | Expired |
| US6222187A | Multiwavelength imaging and spectroscopic photoemission microscope system | Physics | 34 | Expired |
| US6387798B1 | Method of etching trenches for metallization of integrated circuit devices with a narrower width than the design mask profile | Electricity | 33 | Expired |
| US6748019B1 | Dynamic load-balancing between two processing means for real-time video encoding | Electricity | 32 | Expired |
| US6540866B1 | Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate | Electricity | 32 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.