Circuit board with primary and secondary through holes
US6162997A · kind A · utility
41Cited by
13References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 3, 1997 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Jun 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board is provided which has contacts on the surface arrayed to engage contact pads on a chip carrier bounded by a grid. A plurality of primary through holes are provided in the circuit board location within the grid and electrically connected to chip contact pads thereabove. A plurality of secondary through holes are provided which are located outside the grid and electrically connected to the inside of the chip contact pads. The spacing of the contacts on top of the board is less than the spacing of the contacts on the bottom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.