Directed self-heating for reduction of system test time
US6163161A · kind A · utility
12Cited by
3References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 26, 1998 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Aug 26, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2849
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit provides self-heating in order to assist an externally applied thermal control unit raise the temperature of the integrated circuit to a specified range of temperatures at which functional testing is conducted. In a particular embodiment of the present invention, a packaged integrated circuit that is thermally coupled to a heat dissipating device, including but not limited to a heat sink, is operated in a high power manner prior to functional testing, so as to quickly raise internal junction temperatures to a specified test range before functional testing begins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.